Unleaded Solder Paste Market Research: Global Status & Forecast by Geography, Type & Application (2015-2025)
Region:Global
Product Code:99SGL228Che20190500001391
May 2019
85
About the Report
According to 99Strategy, the Global Unleaded Solder Paste Market is estimated to reach xxx million USD in 2019 and projected to grow at the CAGR of xx% during the 2020-2025. The report analyses the global Unleaded Solder Paste market, the market size and growth, as well as the major market participants.
The analysis includes market size, upstream situation, market segmentation, market segmentation, price & cost and industry environment. In addition, the report outlines the factors driving industry growth and the description of market channels.The report begins from overview of industrial chain structure, and describes the upstream. Besides, the report analyses market size and forecast in different geographies, type and end-use segment, in addition, the report introduces market competition overview among the major companies and companies profiles, besides, market price and channel features are covered in the report.
Key Regions
Asia Pacific
North America
Europe
South America
Middle East & Africa
Key Companies
Senju Metal Industry
Tamura
Weiteou
Alpha
KOKI
Kester
Tongfang Tech
Yashida
Henkel AG & Co.
Huaqing Solder
Chengxing Group
AMTECH
Union Soltek Group
Indium Corporation
Nihon Superior
Shenzhen Bright
Qualitek
Nihon Genma Mfg
AIM Solder
Nordson
Interflux Electronics
Balver Zinn Josef Jost
MG Chemicals
Uchihashi Estec
Guangchen Metal Products
DongGuan Legret Metal
Nihon Almit
Zhongya Electronic Solder
Yanktai Microelectronic Material
Tianjin Songben
Key Product Type
Low-temperature Unleaded Solder Paste
Middle-temperature Unleaded Solder Paste
High-temperature Unleaded Solder Paste
Market by Application
SMT
Wire Board
PCB Board
Others
Main Aspects covered in the Report
Overview of the Unleaded Solder Paste market including production, consumption, status & forecast and market growth
2015-2018 historical data and 2019-2025 market forecast
Geographical analysis including major countries
Overview the product type market including development
Overview the end-user market including development
Scope of the Report
Products
Table of Contents
Table of Content
1 Industrial Chain Overview
1.1 Unleaded Solder Paste Industry
1.1.1 Overview
1.1.2 Characteristics of Unleaded Solder Paste
1.2 Upstream
1.2.1 Major Materials
1.2.2 Manufacturing Overview
1.3 Product List By Type
1.3.1 Low-temperature Unleaded Solder Paste
1.3.2 Middle-temperature Unleaded Solder Paste
1.3.3 High-temperature Unleaded Solder Paste
1.4 End-Use List
1.4.1 Demand in SMT
1.4.2 Demand in Wire Board
1.4.3 Demand in PCB Board
1.4.4 Demand in Others
1.5 Global Market Overview
1.5.1 Global Market Size and Forecast, 2015-2025
1.5.2 Global Market Size and Forecast by Geography with CAGR, 2015-2025
1.5.3 Global Market Size and Forecast by Product Type with CAGR, 2015-2025
1.5.4 Global Market Size and Forecast by End-Use with CAGR, 2015-2025
2 Global Production & Consumption by Geography
2.1 Global Production & Consumption
2.1.1 Global Production
2.1.2 Global Consumption
2.2 Geographic Production & Consumption
2.2.1 Production
2.2.1.1 Asia-Pacific
2.2.1.2 North America
2.2.1.3 South America
2.2.1.4 Europe
2.2.1.5 Middle East & Africa
2.2.2 Consumption
2.2.2.1 Asia-Pacific
2.2.2.2 North America
2.2.2.3 South America
2.2.2.4 Europe
2.2.2.5 Middle East & Africa
3 Major Manufacturers Introduction
3.1 Manufacturers Overview
3.2 Manufacturers List
3.2.1 Senju Metal Industry Overview
3.2.1.1 Product Specifications
3.2.1.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.1.3 Recent Developments
3.2.1.4 Future Strategic Planning
3.2.2 Tamura Overview
3.2.2.1 Product Specifications
3.2.2.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.2.3 Recent Developments
3.2.2.4 Future Strategic Planning
3.2.3 Weiteou Overview
3.2.3.1 Product Specifications
3.2.3.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.3.3 Recent Developments
3.2.3.4 Future Strategic Planning
3.2.4 Alpha Overview
3.2.4.1 Product Specifications
3.2.4.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.4.3 Recent Developments
3.2.4.4 Future Strategic Planning
3.2.5 KOKI Overview
3.2.5.1 Product Specifications
3.2.5.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.5.3 Recent Developments
3.2.5.4 Future Strategic Planning
3.2.6 Kester Overview
3.2.6.1 Product Specifications
3.2.6.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.6.3 Recent Developments
3.2.6.4 Future Strategic Planning
3.2.7 Tongfang Tech Overview
3.2.7.1 Product Specifications
3.2.7.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.7.3 Recent Developments
3.2.7.4 Future Strategic Planning
3.2.8 Yashida Overview
3.2.8.1 Product Specifications
3.2.8.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.8.3 Recent Developments
3.2.8.4 Future Strategic Planning
3.2.9 Henkel AG & Co. Overview
3.2.9.1 Product Specifications
3.2.9.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.9.3 Recent Developments
3.2.9.4 Future Strategic Planning
3.2.10 Huaqing Solder Overview
3.2.10.1 Product Specifications
3.2.10.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.10.3 Recent Developments
3.2.10.4 Future Strategic Planning
3.2.11 Chengxing Group Overview
3.2.11.1 Product Specifications
3.2.11.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.11.3 Recent Developments
3.2.11.4 Future Strategic Planning
3.2.12 AMTECH Overview
3.2.12.1 Product Specifications
3.2.12.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.12.3 Recent Developments
3.2.12.4 Future Strategic Planning
3.2.13 Union Soltek Group Overview
3.2.13.1 Product Specifications
3.2.13.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.13.3 Recent Developments
3.2.13.4 Future Strategic Planning
3.2.14 Indium Corporation Overview
3.2.14.1 Product Specifications
3.2.14.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.14.3 Recent Developments
3.2.14.4 Future Strategic Planning
3.2.15 Nihon Superior Overview
3.2.15.1 Product Specifications
3.2.15.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.15.3 Recent Developments
3.2.15.4 Future Strategic Planning
3.2.16 Shenzhen Bright Overview
3.2.16.1 Product Specifications
3.2.16.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.16.3 Recent Developments
3.2.16.4 Future Strategic Planning
3.2.17 Qualitek Overview
3.2.17.1 Product Specifications
3.2.17.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.17.3 Recent Developments
3.2.17.4 Future Strategic Planning
3.2.18 Nihon Genma Mfg Overview
3.2.18.1 Product Specifications
3.2.18.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.18.3 Recent Developments
3.2.18.4 Future Strategic Planning
3.2.19 AIM Solder Overview
3.2.19.1 Product Specifications
3.2.19.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.19.3 Recent Developments
3.2.19.4 Future Strategic Planning
3.2.20 Nordson Overview
3.2.20.1 Product Specifications
3.2.20.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.20.3 Recent Developments
3.2.20.4 Future Strategic Planning
3.2.21 Interflux Electronics Overview
3.2.21.1 Product Specifications
3.2.21.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.21.3 Recent Developments
3.2.21.4 Future Strategic Planning
3.2.22 Balver Zinn Josef Jost Overview
3.2.22.1 Product Specifications
3.2.22.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.22.3 Recent Developments
3.2.22.4 Future Strategic Planning
3.2.23 MG Chemicals Overview
3.2.23.1 Product Specifications
3.2.23.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.23.3 Recent Developments
3.2.23.4 Future Strategic Planning
3.2.24 Uchihashi Estec Overview
3.2.24.1 Product Specifications
3.2.24.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.24.3 Recent Developments
3.2.24.4 Future Strategic Planning
3.2.25 Guangchen Metal Products Overview
3.2.25.1 Product Specifications
3.2.25.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.25.3 Recent Developments
3.2.25.4 Future Strategic Planning
3.2.26 DongGuan Legret Metal Overview
3.2.26.1 Product Specifications
3.2.26.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.26.3 Recent Developments
3.2.26.4 Future Strategic Planning
3.2.27 Nihon Almit Overview
3.2.27.1 Product Specifications
3.2.27.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.27.3 Recent Developments
3.2.27.4 Future Strategic Planning
3.2.28 Zhongya Electronic Solder Overview
3.2.28.1 Product Specifications
3.2.28.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.28.3 Recent Developments
3.2.28.4 Future Strategic Planning
3.2.29 Yanktai Microelectronic Material Overview
3.2.29.1 Product Specifications
3.2.29.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.29.3 Recent Developments
3.2.29.4 Future Strategic Planning
3.2.30 Tianjin Songben Overview
3.2.30.1 Product Specifications
3.2.30.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.30.3 Recent Developments
3.2.30.4 Future Strategic Planning
4 Market Competition Pattern
4.1 Market Size and Sketch
4.2 Company Market Share
4.2.1 Global Production by Major Manufacturers
4.2.2 Market Concentration Analysis
4.3 Market News and Trend
4.3.1 Merger & Acquisition
4.3.2 New Product Launch
5 Product Type Segment
5.1 Global Overview by Product Type Segment
5.2 Segment Subdivision by Product Type
5.2.1 Market in Low-temperature Unleaded Solder Paste
5.2.1.1 Market Size
5.2.1.2 Situation & Development
5.2.2 Market in Middle-temperature Unleaded Solder Paste
5.2.2.1 Market Size
5.2.2.2 Situation & Development
5.2.3 Market in High-temperature Unleaded Solder Paste
5.2.3.1 Market Size
5.2.3.2 Situation & Development
6 End-Use Segment
6.1 Global Overview by End-Use Segment
6.2 Segment Subdivision
6.2.1 Market in SMT
6.2.1.1 Market Size
6.2.1.2 Situation & Development
6.2.2 Market in Wire Board
6.2.2.1 Market Size
6.2.2.2 Situation & Development
6.2.3 Market in PCB Board
6.2.3.1 Market Size
6.2.3.2 Situation & Development
6.2.4 Market in Others
6.2.4.1 Market Size
6.2.4.2 Situation & Development
7 Market Forecast & Trend
7.1 Regional Forecast
7.2 Consumption Forecast
7.2.1 Product Type Forecast
7.2.2 End-Use Forecast
7.3 Investment Trend
7.4 Consumption Trend
8 Price & Channel
8.1 Price and Cost
8.1.1 Price
8.1.2 Cost
8.2 Channel Segment
9 Market Drivers & Investment Environment
9.1 Market Drivers
9.2 Investment Environment
10 Research Conclusion
Research Methodology
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